LED display heat dissipation problem

Nowadays most of LED screen, LED display manufacturers, in PCB design almost always face to the problem of heat dissipation, especially because of the thermal effect produced by the LED driver chip normal luminescence properties; Color uniformity, in turn, affects the whole screen. How to solve the heat dissipation problem really let the designers have a headache. This article will further illustrate how to change the drive chip package to solve the problem of driver chip heat dissipation.
QFN packages (QuadFlatNoLeads) - QFN is by the Japanese electronic machinery industry and the name of the (JEDEC) requirements.
Four side flat pack with no pin, SMT type packaging, one of a kind of bottom of welding plate, small size, small size, with plastic as the sealing material of emerging SMT chip packaging technology. Since QFN packages do not like traditional SOIC package with gull wing, lead internal pins and the bonding pad between the conductive path is shorter, so the self-induction coefficient and encapsulation body wiring resistance is very low, so it can provide excellent performance, but also because of no gull wing can reduce more so-called antenna effect lead to reduce overall electromagnetic interference (EMC/EMI).
In addition, it also by the leakage of lead frame welding plate provides excellent cooling performance, the welding plate has a direct cooling channel, used for release of encapsulated within the chip's heat. Usually will be heat welded plate welded on the circuit board directly, and PCB in the heat dissipation holes will help redundant power diffusion into the copper ground plate, which absorbs excess heat; Can also through which to achieve better results. QFN packages body in general has a large number of mobile phones and laptop computers, but is to flourish in the LED display.